PCB Chat

Lorain County Community College, located in northeast Ohio, about 30 miles west of Cleveland, became in 2018 the first community college to offer an applied bachelor’s in microelectronic manufacturing. And a year ago, it formed the Manufacturing Electronics & Rework Institute for Training, or MERIT, which the hands-on training lab. Last spring, the program graduated its first students. Johnny Vanderford, the director of MERIT and an assistant professor of MEMS at LCCC, and Courtney Tenhover, program developer, Engineering, Business, and Information Technologies, join Mike Buetow to discuss how industry companies shape the program curriculum and its potential for adoption by other colleges.

Larry Marcanti, executive director of the High Density Packaging User Group (HDP), and Madan Jagernauth, marketing director and project facilitator, talk with Mike Buetow about the trade consortium's recent semiannual meeting and its recently finished projects, including one for SIR. HDP  (hdpusergroup.org) is a consortium of more than 50 global companies that conceives and runs projects on electronics packaging and reliability. It has completed more than 50 such projects over the course of its 25 years.   

Larry Welk is co-owner of Smart Splice. Larry is a business owner with a history of working in the electrical and electronic manufacturing industry. Skilled in sales, business management, business development, business process improvement, and sales management, Larry says he obtained a Master's degree from the school of hard knocks. After getting knocked down, he says he always focused on learning and getting back up again, a valuable lesson we can all learn from! Mike Konrad talks to Larry about his “up and down” journey and learn what knocked him down and, more importantly, what his inspiration and techniques were to get back up again.  

Miles Moreau, KIC’s general manager, has been with KIC for nearly three decades. He draws his deep and rich expertise from managing multiple business units across four continents spanning operations, field service, and sales and marketing channels. His expertise is in thermal management and that’s exactly what we’re going to talk about today. We’ve discussed how to profile a board on this show. Today, we’re going to talk about profiling an oven and a wave soldering machine, and how, when done correctly, may reduce the number of times one has to attach thermocouples to a circuit board and run it through an oven or wave soldering machine.  

Jorge Cardona is CEO of Invertronica Group, the parent company of a trio of firms in Colombia. Those companies include Tecrea, an electronics design and engineering unit; LosComponentes.com.co, a parts distributor, and Colcircuitos, the largest EMS company in Colombia.  He speaks with Mike Buetow on markets and manufacturing in Central America, and why Colombia is a nearshore possibility for US OEMs and EMS companies looking for low-cost partners.

Paul Salerno holds an MBA with specialization in finance and marketing from Rutgers Graduate School of Business. He is global portfolio manager at MacDermid Alpha Electronic Solutions with expertise in product lifecycle management and development of strategic technology roadmaps for the global surface mount technology business.   Paul works with customers in both Europe and Asia with customers in automotive, computing, communications and consumer electronic markets. Paul and Mike Konrad discuss soldering materials including "high reliability" solder paste, low and ultra-low solder pastes, and design-for-use solder paste selection processes.   Paul may be reached here: Paul Salerno Portfolio Manager, SMT Assembly Solutions Paul.Salerno@MacDermidAlpha.com  

The second quarter was "dynamite" for PCB design software sales, explains Wally Rhines, referring to the 16% year-over-year increase in ECAD sales. Rhines, the longtime Mentor CEO and spokesperson for the ESD Alliance, joins market research guru Merlyn Brunken of Siemens to review the latest market data and discuss the history of semiconductor trade wars and relationships between PCB and IC design starts with PCB Chat host Mike Buetow.  

Episode 80: Cheryl Tulkoff & Greg Caswell's Book “Design for Excellence in Electronics Manufacturing”.   My guests Cheryl Tulkoff and Greg Caswell discuss their new book "Design for Excellence in Electronics Manufacturing" (published by Wiley and available on Amazon, Barnes & Noble, and Wiley). An authoritative guide to optimizing design for manufacturability and reliability from a team of experts Design for Excellence in Electronics Manufacturing is a comprehensive, state-of-the-art book that covers design and reliability of electronics. The authors—noted experts on the topic—explain how using the DfX concepts of design for reliability, design for manufacturability, design for environment, design for testability, and more, reduce research and development costs and decrease time to market and allow companies to confidently issue warranty coverage. By employing the concepts outlined in Design for Excellence in Electronics Manufacturing, engineers and managers can increase customer satisfaction, market share, and long-term profits. In addition, the authors describe the best practices regarding product design and show how the practices can be adapted for different manufacturing processes, suppliers, use environments, and reliability expectations. This important book contains a comprehensive review of the design and reliability of electronics covers a range of topics: establishing a reliability program, design for the use environment, design for manufacturability, and more. Includes technical information on electronic packaging, discrete components, and assembly processes shows how aspects of electronics can fail under different environmental stresses. Written for reliability engineers, electronics engineers, design engineers, component engineers, and others, Design for Excellence in Electronics Manufacturing is a comprehensive book that reveals how to get product design right the first time.   Cheryl Tulkoff may be reached here: cheryl.tulkoff@ni.com   Greg Caswell may be reached here: greg.caswell@ansys.com

Mike Konrad speaks with Dave Trail from Arch Systems about Industry 4.0.   Dave may be reached at dtrail@archsys.io 808-868-8298

Electrically conductive adhesives (ECAs) have been touted for decades as a potential replacement for solder. Technology roadmaps by organizations ranging from IPC to the Surface Mount Council often listed ECAs as a “coming” technology, and scores of papers have been presented highlighting possible uses and likely end-products. The international research firm IDTechEx released in early October a new study called “Electrically Conductive Adhesives 2022-2032: Technologies, Markets, and Forecasts.” Matthew Dyson, Ph.D., a senior technology analyst at IDTechEx specializing in printed, organic and flexible electronics, spoke with Mike Buetow about the study’s findings and the future of ECAs, including in-mold and flexible electronics and their potential applications.