Embedded Insiders

Sean Dougherty, VP at Everspin Technologies, explains MRAM and the memory capacity and pricing crunch from AI demand. Robert Otręba, CEO of GRINN, outlines compact Edge AI system-on-modules and ready-to-deploy SBCs. They discuss sustainable AI's resource toll, practical Edge AI demos at Embedded World, modular hardware trends, and which markets face memory pain.

Steve Tateosian, Infineon SVP focused on power conversion and wide-bandgap devices, and Heinz-Peter Beckemeyer, TI director for semiconductor cybersecurity strategy, join the conversation. They unpack the EU Cyber Resilience Act’s scope, legacy device challenges, compliance planning, and supplier coordination. They also explore industrial power conversion in data centers, wide-bandgap adoption, system-level efficiency, and developer tools for faster design.

Send us Fan MailOn this episode of Embedded Insiders, Editor-in-Chief Ken Briodagh sits down with Ansgar Hein, Chairman of the Board at SGET e.V., to discuss the new Open Harmonized FPGA Module (oHFM) standard, the world’s first open standard specifically designed for FPGA and SoC-FPGA modules. Watch the segment here: https://youtu.be/mDyAJ8gfpg8Next, contributing editor Rich Nass is joined by Thistle Technologies’ Founder and CEO, Window Snyder, to discuss the importance of incorporating security into your design. But first, Ken, Rich, and I are back from embedded world 2026 in Nuremberg, and we’re giving you a recap of all the top trends and technologies we saw. For more information, visit embeddedcomputing.com

Send us Fan MailOn this episode of Embedded Insiders, Rich and Vin sit down with Gabor Kiss-Vamosi, the Founder and CEO of LVGL, to discuss the open-source embedded Light and Versatile Graphics Library, designed to support both elaborate and simple UI design. Next, Rich and Axel Sikora, Chairman of the embedded world Technical Committee, discuss some highlights of the upcoming event.But first, we're giving you a glimpse into what Embedded Computing Design has planned for the quickly approaching 2026 embedded world  Exhibition&Conference in Nuremberg, Germany.For more information, visit embeddedcomputing.com

Send us Fan MailIn this episode of Embedded Insiders,  Mikko Savolainen, Silicon Labs' Senior Product Line Director of Commercial, joins the podcast to discuss the partnership between Silicon Labs and Emanate Wireless on the RadioVision solution. The battery-powered, AI-enabled Bluetooth doorway chokepoint system is a Real-Time Location System (RTLS) designed to help hospitals accurately track staff, patients, and equipment. Watch the video segment here: https://www.youtube.com/watch?v=gwJoOMbcg4gNext, Rich and Simon Ford, the Founder of Blecon, discuss the joining forces of Bluetooth and Industrial, and how Bluetooth is enmeshed in the industrial sector. But first, we're highlighting some recent research from Penn State on DNA-based data storage. Researchers have combined synthetic DNA with electronic materials to create a brand-new kind of computer memory. For more information, visit embeddedcomputing.com

Send us Fan MailIn this episode of Embedded Insiders, Marilyn C. Wolf, professor of Engineering at the University of Nebraska-Lincoln, joins the podcast to discuss the importance of students understanding scope, having a balanced understanding of both hardware and software, and the needs of today’s engineering workforce. Watch the segment here: https://www.youtube.com/watch?v=57Cl1JBwiRQNext, Rich and Vin are joined by John Janowiak, Executive Director of ECEDHA (Electrical and Computer Engineering Department Heads Association), to discuss whose responsibility it is to prepare people for real work — schools, companies, or individuals?But first, Ken and I are giving our own opinions on these topics, pondering whether it’s realistic to expect schools to fully prepare students for modern jobs, or should companies help teach and invest in the next generation of engineers?For more information, visit embeddedcomputing.com

Sandra Rivera, former Intel exec now Chairwoman at Visora, helps scale networking and leads AI inference chip strategy. Dennis Nikles, Managing Director at Vodafone IoT Americas, runs large-scale connectivity and IoT platforms. They discuss recent semiconductor M&A, Visora’s low-latency inference chips and roadmap, massive IoT connectivity scale, rising data for AI, 5G/NTN trends, security layers, and device migration challenges.

Send us Fan MailIn this episode of Embedded Insiders, Krishna Rangasayee, Founder and CEO of SiMa.ai, joins the podcast to discuss advancements surrounding physical AI at the edge. His company is focused on a software-centric Physical AI hardware and software platform, and we dive into some of the trends and challenges in this space. Next, Rich is joined by Alex Iuorio, Avnet’s Senior Vice President for Global Supplier Development, to discuss the company’s recent survey covering AI’s Impact on Engineering. The two review the results and what they mean for the future of AI. But first, Ken and I share our thoughts, feelings, and hesitations around the growth of Physical AI.For more information, visit embeddedcomputing.com

Sumeet Kumar, CEO of Innatera Nanosystems, builds energy-efficient neuromorphic chips like Pulsar for edge sensors. Paul Golden, Marketing Director at the Wireless Power Consortium, leads Qi/Ki wireless power standards and certification. They discuss spiking neural networks, hardware-software co-design, temporal sensing at the edge, and recent advances in wireless charging standards and applications.

Tom Gall, VP of Technology at RISC-V International, explains RISC-V’s ISO milestone, RVA23 and RVM profiles, automotive and data center use, and ISA extension tradeoffs. Kevin Lu, Associate Dean at Stevens Institute of Technology, discusses integrating generative AI into engineering education, redesigning assessments, and preparing students for evolving careers.