Anyone who has entered a data center will be familiar with the upright rack design that has become standard in data halls around the world.
But while piling up the “pizza boxes” has served the industry well for decades, the advent of liquid cooling systems, developed to meet the thermal needs of advanced chips, means a new approach may be needed.
Cooling firm Air2O is thinking outside the (pizza) box, and has come up with a modular, stackable design for data center racks, which it says can improve cooling efficiency.
On this episode, DCD speaks to Air2O’s Iggy Kogan about the new design, dubbed the High Thermal Density Air-Cooled Rack Assembly.
DCD Zero Downtime: The Bi-Weekly Data Center Show