Chip Stock Investor Podcast

Investing in the Future of Semi Manufacturing: ASML's Advanced Packaging Play

Mar 30, 2026
Discussion of ASML’s pivot from EUV to advanced packaging tools and the Twinscan XT:260 revival of i-line lithography. A look at wafer warpage and 3D chip stacking challenges. Competitor landscape including Onto, Lam, Applied and BESI rumors. Talk about custom optics with Carl Zeiss and whether packaging could shift future revenues.
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ADVICE

Prepare For A Fab Equipment Revenue Heat Up In 2026

  • Expect a semiconductor equipment revenue pickup in H2 2026 extending into 2027 and monitor fab equipment stocks for that recovery.
  • Nicholas suggests the recent sell-off in the Fab Five may be temporary ahead of this cyclical heat-up.
INSIGHT

Advanced Packaging Is The New Semiconductor Focus

  • Advanced packaging is becoming a major focus shift from front-end lithography in semiconductors.
  • Nicholas and Casey highlight substrates, interposers, and novel panel materials as the new battleground beyond wafer front-end work.
INSIGHT

Many Vendors Compete In Advanced Packaging Equipment

  • Multiple equipment vendors compete in packaging across etch, deposition, bonding, and substrate handling.
  • Casey calls out Lam Research, Applied Materials, BESI, Tokyo Electron, Kulicke & Soffa, and ASMPT as active players and possible M&A focal points.
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