TBPN cover image

In-Car Surveillance, Goblin-Mode, Jon Gray from Blackstone Joins | Colleen Aubrey, Anthony Liguori, Colin Zima, Alex Epstein, Shira Lazar, Anshul Gupta, Apurva Shrivastava, Bubble Boi

TBPN

00:00

Advanced Packaging Becomes the New Moore's Law

Bubble Boi says Intel's opportunity increasingly hinges on advanced packaging, HBM integration, and packaging bottlenecks rather than node shrink alone.

Play episode from 01:58:47
Transcript

The AI-powered Podcast Player

Save insights by tapping your headphones, chat with episodes, discover the best highlights - and more!
App store bannerPlay store banner
Get the app