MacBreak Weekly (Audio) cover image

MBW 1011: Oy and Whoop! - iPhones to the Moon!

MacBreak Weekly (Audio)

00:00

M5 Pro/Max chiplet packaging rumor

Jason and Dan analyze Vadim/Max Tech claims that M5 Pro and M5 Max may share modular chiplets and new 2.5D packaging.

Play episode from 21:46
Transcript

The AI-powered Podcast Player

Save insights by tapping your headphones, chat with episodes, discover the best highlights - and more!
App store bannerPlay store banner
Get the app